// FINISHING — TIN PLATING
Tin Plating Matte & Bright
Electrodeposited tin for aluminum, steel, brass, bronze, and copper — solderable, electrically conductive, and corrosion-resistant in matte or bright finish.
Tin plating electrodeposits a layer of pure tin onto a metal substrate to provide a solderable, electrically conductive, and corrosion-resistant surface. It is widely used in electronics, electrical connectors, bus bars, and RF components where solder adhesion and low contact resistance are critical requirements. Rigid Concepts coordinates tin plating through our trusted finishing partner NorTex Metal Finishing, with matte and bright finish options available on a broad range of substrates.
Matte vs. bright tin
Bright tin produces a shiny, reflective surface and is the familiar finish on consumer electronics components. Matte tin produces a duller, satin finish with larger grain structure that is less prone to tin whisker growth — a critical consideration for high-reliability electronics where whiskers can cause short circuits. Matte tin is the preferred call-out in many aerospace, defense, and medical electronics specifications for this reason.
- Matte tin — larger grain, reduced whisker risk, preferred for high-reliability electronics
- Bright tin — smooth, reflective surface for general electrical and consumer applications
- Excellent solderability — direct solder adhesion without flux on most substrates
- Low electrical contact resistance — suited for connectors, bus bars, and contacts
- Good corrosion resistance for indoor and mild-environment electrical assemblies
Substrate compatibility
Tin plates readily onto copper, brass, and bronze — the standard substrates for electrical connectors and bus bars. It is also applied to steel for corrosion protection and to aluminum (with appropriate underplating for adhesion). Our partner NorTex handles the full range of substrates common to precision machined electronic and electrical components.
Size capability
NorTex handles parts up to 40" × 24" for tin plating. High-volume small parts can also be barrel plated — contact us to confirm which process suits your geometry and quantity.
| Process | Electrodeposited tin (rack; barrel for small parts) |
|---|---|
| Finish options | Matte · Bright |
| Substrates | Aluminum · Steel · Brass · Bronze · Copper |
| Max part size | 40" × 24" |
| Key properties | Solderable · Electrically conductive · Corrosion resistant |
Tin plating is a natural finishing step for precision electronics components and electrical connectors machined in our shop. For parts that need uniform coating in complex internal geometry, see electroless nickel plating. For aluminum parts needing conductivity with corrosion protection, see chem film / conversion coating.
// FAQ
Frequently asked questions
Matte tin has a larger grain structure that is significantly less prone to tin whisker growth. Tin whiskers are microscopic metallic filaments that can grow from bright tin deposits over time and cause short circuits in tight-pitch electronics. Aerospace, defense, and medical specs commonly require matte tin for this reason.
Yes. Tin is inherently solderable and one of the primary reasons it is specified for electrical connectors, terminals, and RF components. Proper tin-plated surfaces can be soldered with minimal flux and maintain good solder adhesion over the service life of the part.
Yes, but aluminum requires an appropriate underplate (typically a zincate or nickel strike) to ensure adhesion. We coordinate this at the process level through NorTex — send your drawing and we will confirm the substrate and any required underplating steps.
Thickness depends on the application. Electrical connector applications typically specify 0.0001" to 0.0003" (100–300 micro-inches). Corrosion-protection applications may call for heavier deposits. We plate to your drawing call-out.
Send us the hard one.
Upload your drawing or STEP file and we'll come back with pricing and lead time — from a single high-mix part to full production runs, held to exacting tolerances.